| 摘要 |
<p>PROBLEM TO BE SOLVED: To assemble the plane for a grounding part, a power part and the like or other circuit parts in the semiconductor package, and the semiconductor device manufactured by utilizing a tape bonding process. SOLUTION: A chip mounting part 12, on which a semiconductor chip 50 is mounted, is provided. A tape 10 having the flexibility, wherein a wiring pattern 14 electrically connected to the semiconductor chip 50 on the surface is provided, is formed. A circuit wiring pattern 22, which is constituted so as to from the frame shape for surrounding a chip mounting part 12 of the tape 10 and connected to the wiring pattern electrically, is provided. A frame-shaped substrate 20, which is fixed to the tape 10 and enhances the rigidity thereof, is provided.</p> |
