| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize a ceramic package having more improved heat sink property to cope with the tendency of a mounted semiconductor toward a higher speed thereof and an increasing degree of heat generation therefrom. SOLUTION: A resin film 10 having a conductive layer 9 for connection with an electrode pad of a semiconductor device 6, is bonded to a ceramic substrate 2 mounting the semiconductor device 6 thereon. At the same time, a resin film 14 serving as an insulation layer is bonded to the resin film 10. At each portion, of the resin film 14, which corresponds to connecting point of the conductive layer 9 to each of inner interconnection layers 3 of the ceramic substrate 2, a land 14a is provided to which a heat sink metal projection 15 is bonded with a solder.</p> |
