| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a lead frame for semiconductor device which are improved in quality by suppressing the occurrence of defective bonding in a wire bonding process. SOLUTION: The front end sections of inner leads 8 are bent downward by about 45 deg. from the horizontal plane. A recessed groove 10 is provided on a heat block 1 at the position where the front end sections of the inner leads 8 are positioned. Therefore, the wire bonding of the inner leads 8 can be performed stably by preventing the floating of the leads 8, because the front end sections of the leads 8 are put in the groove 10. |
