发明名称 PART MOUNTING DEVICE AND PART MOUNTING METHOD
摘要 PROBLEM TO BE SOLVED: To secure height accuracy without requiring severe control on a part height and a thickness of sliver paste or the like, and relieve complication of a manufacturing process by arranging spacers having a length higher than a part height on both ends of a collet, and mounting a part by injecting an adhesive into a space between the part and a mounting surface generated when the spacers are pushed against the mounting surface. SOLUTION: A part mounting device is composed of a collet 11, spacers 12 and an adhesive injecting part 13. The collet 11 attracts and fixes a part 20. The spacers 12 are arranged on both ends of the collet 11, and have a length slightly higher than a height of the part 20. When the part 20 attracted by the collet 11 is mounted on a mounting surface 30, the spacers 12 are pushed against the mounting surface 30. The adhesive injecting part 13 injects an adhesive into a space 40 between the part 20 and the mounting surface 30 generated when the spacers 12 are pushed against the mounting surface 30. In this way, the part 20 is adhered to the mounting surface 30.
申请公布号 JPH10253863(A) 申请公布日期 1998.09.25
申请号 JP19970059116 申请日期 1997.03.13
申请人 SONY CORP 发明人 NEMOTO KAZUHIKO
分类号 G02B7/00;G11B7/135 主分类号 G02B7/00
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