发明名称 DEVICE FOR SEALING RESIN OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent molten resin from entering the gap of a sliding face between a runner block and a sliding core by integrating the runner block and the sliding core and forming a cylindrical pot, where a plunger vertically moves in the integrated sliding block. SOLUTION: A cylindrical pot 132 is vertically formed at the center of a sliding block 130 where the sliding core and a runner block are integrated. A plunger 134 is incorporated in respective pots 312, so that it is freely vertically movable. A runner ejector pin hole 144A is formed in the sliding block 130, in parallel with the pot 132 and the runner ejector pin 144 is incorporated in the hole, so that it can slide vertically. Thus, the sliding block 130 around the pot 132 vertically moves as a whole. The sliding face between the sliding core and the runner block can be omitted and melting resin can be prevented from entering the gap of the sliding face.
申请公布号 JPH10256290(A) 申请公布日期 1998.09.25
申请号 JP19970210485 申请日期 1997.08.05
申请人 SUMITOMO HEAVY IND LTD 发明人 NEGISHI TAKEHITO
分类号 H01L23/29;H01L21/56;H01L23/31;(IPC1-7):H01L21/56 主分类号 H01L23/29
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