CONNECTOR HEAT-CRIMPING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a connector heat-crimping method in which elongation control of a resin film at the time of heat crimping can be properly performed to eliminate positional dislocation of a terminal on a substrate to a lead on a connector for improving production yield. SOLUTION: A width size of a terminal line 30a on a substrate 11 is set to be a little larger than a width size of a lead line 31a on a connector 12, heat-crimping is performed by a heat-crimping load to allow thermal expansion of the connector 12 while detecting above two sizes in an optical way, and when the two sizes coincide with each other, heat-crimping is performed at such a strong heat-crimping load that thermal expansion is not allowed. Size difference between the lead line 31a on the connector 12 and the terminal line 30a on the substrate 11 can thus be corrected in a simple method of changing the heat-crimping load to reduce generation of defectives by dislocation of a terminal 30 on the substrate 12 from a lead 31 on the connector 12, and improve production yield.