| 摘要 |
PROBLEM TO BE SOLVED: To realize strong connecting of copper to copper, without the use of temperature of a melting point or higher for copper by microetching at least one copper or copper alloy surface to bring it into contact, and laminating it at specific temperature and pressure. SOLUTION: Two boards are microetched in an aqueous solution of sodium peroxide at about 20 deg.C. Two circuit boards aligned before connecting have a dielectric board 1 using polytetrafluoroethylene as a base material, an embedded circuit line 2, an inner circuit line 3, an external circuit line 4, and a plated through-hole 5. The two surfaces are brought into contact with one another, and laminated at least at about 300 degrees to less than the melting point of copper at least at a pressure of about 105.45 kgf/cm<2> . Thus, superior connecting force is exhibited, and numerous steps necessary for conventional connecting method can be omitted. |
