| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead for light emitting element, and a semiconductor light emitting element employing it, which can be wire bonded easily and automatically even if an LED chip, provided with a pair of electrodes to be wire bonded on one side thereof, is mounted while being turned. SOLUTION: A LED chip 20 has a first lead 1 provided, at the forward end thereof, with a die pad 1a to be die bonded and a second lead 2 surrounding the die pad of the first lead 1 and provided, at the forward end thereof, with a ring-like pad 2a to be wire bonded. An LED chip 20 is die bonded to the die pad 1a and the pair of electrodes thereof are connected, respectively, with the first and second leads 1, 2 through a wire thus forming a light emitting lamp. |
