发明名称 MODULE FOR COMMUNICATION APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a module for a communication apparatus which can be made thin and prevent jolting of a metal cover. SOLUTION: Two parallel cutouts 5 are made in each of two opposing surfaces of bent parts 4 of a metal cover 3 to form a resilient engagement pawl. A tip end of the pawl 6 is bent inwards, notches 8 are made in edges of a metal base 2 so as face the respective pawls 6, a printed circuit board 1 is bonded with an adhesive onto the metal base 2, the metal cover 3 is mounted on the board, so that the engagement pawls 6 are engaged with the associated notches 8. At the time of the engagement, the end faces of the bent parts 4 abut on the metal base 2 so as to interpose the board 1 by the bent parts.
申请公布号 JPH10256769(A) 申请公布日期 1998.09.25
申请号 JP19970056432 申请日期 1997.03.11
申请人 OKI ELECTRIC IND CO LTD 发明人 YAMABE TOYOICHI
分类号 H05K5/00;H04B10/00;H05K5/04;H05K9/00 主分类号 H05K5/00
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