| 摘要 |
PROBLEM TO BE SOLVED: To prevent air-containing state of a semiconductor pellet, when being mounted, due to a unstable shape and position of molten solder supplied on a lead frame. SOLUTION: Solder 6 is supplied to a predetermined position on a lead frame 1, which moves on a conveyance path while it is heated, and the solder 6 melts. The molten solder 6 is formed to have a smooth convex surface with a protruded central portion by a solder-forming portion 10, which has a concave lower end surface curved from its central portion toward the peripheral end, and which rotates about its axis.
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