IMPROVED SURFACE STRUCTURE OF ELECTROSTATIC CHUCK AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To improve the temp. uniformity over the entire wafer surface and avoid increasing the manufacturing cost by providing protrudent regions and nonprotrudent regions at a workpiece support surface so that the total surface area of the protrudent regions is less than that of the nonprotrudent regions. SOLUTION: Protrudent regions and nonprotrudent regions are provided at a workpiece support surface 107 of the electrostatic chuck 100 so that the total surface area of the protrudent regions is less than that of the nonprotrudent regions. The support surface 107 has e.g. a first dielectric layer 113, conductor layer 112, second dielectric layer 116 and flexible circuit 120 mounted on the surface 101 of a pedestal 102 through a first adhesive layer 118. The pedestal has a rising rim 104 at the periphery; the diameter of the rim is approximately equal to that of a wafer to be treated and the wafer periphery is supported with the rim.