| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the cooling time and prevent the contamination with dust by providing a flat board on a heat-up stage with a space, connecting one end of a piping to this board and connecting a vacuum pump to the other end thereof. SOLUTION: A flat board 11 is disposed on a wafer heat-up stage with a space, a piping 12 connected to the board 11 at one end 12a has an opening 12h at the heat-up stage 21, and a vacuum pump 13 is connected to the other end 12b of the piping 12. To cool the stage 21, e.g. the board 11 of a cooler 1 is set at a distance of about 0.5-15mm pref. 1-10mm from the top face of the stage 21 and the pump 13 is driven to suck a gas from a space 15 between the board 11 and stage 21 through the piping 12.</p> |
