| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting equipment which can prevent tension from a pressing head from being applied to a protective tape. SOLUTION: A mounting equipment 1 is used for press-bonding an IC 12 against electrode glass 11 through an anisotropic conductive adhesive and is provided with a press-bonding head 4 which can be moved toward and from the IC 12 and press-bonds the IC 12 against the glass 11, an unwinding reel 21 and a take-up reel 22 to which the end sections of a protective tape 5 passed through the space between the head 4 and IC 12 are respectively connected, and guide rollers 24 and 25 which can be moved toward and from the IC 12 and guide the tape 5. The guide rollers 24 and 25 can move the tape 5 and can prevent the energization of the tape 5 by the head 4. |
