| 摘要 |
PROBLEM TO BE SOLVED: To easily determine where a crystal orientation is to be marked to produce a notchless wafer at a high work efficiency, by engraving the orientation mark at specified position from a notched reference by the laser marking and chamfering to remove the notch to form a genuine circular wafer. SOLUTION: A notch 1 extending along the axis of an ingot is cut into the side face of the ingot at specified crystal orientation position, the ingot is sliced into wafers of specified thickness by an inner blade or wire saw, and a crystal orientation mark 2 is formed at a final depth of approximately 10μm or more into the surface of the sliced wafer using a hard laser marker. Thus, the engraved position of the mark 2 is determined from the notch 1 as a reference, and hence notchless wafers can be produced without setting the wafers one by one in an X-ray analyzer. |
