| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for manufacturing a plastic package in which leakage of packaging plastic resin from a metal mold is prevented, when a semiconductor device is packaged while at least a part of a heat sink is exposed. SOLUTION: In a plastic case of a heat sink element 25, a side surface which is projected from the plastic case is sloped. Further, an inner sidewall 28 of a housing 26, which is opposite to the side surface, is sloped. When a metal mold 23 is closed by thrust means, a pressing force is applied to a peripheral portion of the heat sink element 25, so as to temporarily seal up the side surface with the inner sidewall 28. |
