| 摘要 |
The invention concerns a method for including a thin electronic label (1) with a plane surface, at a predetermined depth in a wall of a moulded plastic object (15) under predetermined pressure and temperature. The method is characterised in that: first, the plane surface of the label (1) is glued on a plastic substrate (5) with thickness substantially equal to the depth required for the inclusion; the substrate (5) is glued to the mould wall (13); then the plastic moulding material (15) is placed in the mould (13, 14) under said pressure and temperature, the plastic material for the label substrate (5) being selected according to the moulding plastic material (15) and to said pressure and temperature so as to produce a close bonding by melting in the contact region (8, 9, 10, 16) between the two plastic materials during the moulding operation. |
