| 摘要 |
A semiconductor device, in which failure in filling of a resin is prevented. In order to improve a heat radiating property, a metallic, heat radiating plate (103) having a good thermal conductivity is used and sealed in a resin portion (107). Inner leads (101) are attached to the heat radiating plate (103) and provided with bent portions. The heat radiating plate (103) is positioned centrally in a thicknesswise direction of the resin portion (107). With the arrangement, substantially equal spacings are provided above and below the heat radiating plate (103), so that a resin filling property is improved and semiconductor devices can be manufactured without generation of failure such as unfilled condition or the like. |
