| 摘要 |
A method of producing packaged optronic integrated circuit devices comprises (a) providing a transparent protective layer (26) overlying a first surface of a semiconductor wafer (20) including a plurality of dies; (b) forming notches extending into the wafer (20) from a second surface of the wafer (20), the notches being disposed at dice lanes between the dies; (c) providing an insulating layer (42) overlying the second surface of the wafer (20) and having an outer surface facing away from the wafer (20); (d) forming contacts electrically connected to the dies, the contacts extending outo the outer surface of the insulating layer (42); and then severing the transparent protective layer (26) to separate the dies from one another. |
