| 摘要 |
PURPOSE:To obtain the title capacitor having a high heat-resisting property and a low moisture-adsorbing property by a method wherein a dielectric, which is formed by adding methylhydrogenpolysiloxane and diisoproxybis(acetylacetonato)titanium to a high molecular compound having an OH radical, is used. CONSTITUTION:A dielectric layer is constituted by a dielectric formed by adding methylhydrogenpolysiloxane of 0.5 to 20wt.% and diisoproxybis(acetylacetonato) titanium of 0.5 to 40wt.% to the high molecular compound having at least OH radical. Accordingly, the OH radical and the above-mentioned additives form O-Si bonds or O-Ti bonds by chemical reaction, a three-dimensional crosslinking organic metal compound layer, having a very low moisture permeability, is formed in the vicinity of the surface of the dielectric layer, and the rate of increase of an apparent relative permittivity caused by moisture absorption is reduced. Besides, the lowering of thermal deformation temperature can be prevented by the conjoint use of diisoproxybistitanate. As a result, a high heat-resistant and low hygroscopic capacitor can be obtained. |
