Heated and cooled vacuum chamber shield

摘要

The disclosure relates to an apparatus and method for reducing particulates in a semiconductor processing chamber (30). The apparatus comprises a shield (46) for lining a portion of the interior of a vacuum processing chamber (30). The interior of the shield defines a shield passage (141). A heater element (147) is disposed within the shield passage. A gas inlet (149) is used for providing gases to the interior of the shield passage. The range of temperatures which may be used is wide and generally fitted to the process. For example, the invention may be used to provide a rapid cooldown or breakout. Once the temperature is chosen, isothermal conditions can be maintained so as to minimize the thermal cycle stress, reducing cracking, peeling, etc.