发明名称 Clamp mechanism of diffusion bonding apparatus
摘要 A clamp mechanism of diffusion bonding apparatus comprising a first clamp unit for gripping near the end portion of the bonding object, and a second clamp unit for gripping the bonding object at a position farther from the end portion of the bonding object than the first clamp unit, in which deformation of the end portion of the bonding object is prevented by the first clamp unit, and the second clamp unit grips so as to obtain a desired pressing force at the bonded joint of the bonding object. <IMAGE>
申请公布号 EP0865862(A1) 申请公布日期 1998.09.23
申请号 EP19980103484 申请日期 1998.02.27
申请人 DAIDO TOKUSHUKO KABUSHIKI KAISHA 发明人 TSUCHIYA, MASAKI
分类号 B23Q3/06;B23K20/00;B23K20/02;B23K20/26;B23K35/00 主分类号 B23Q3/06
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