Process for structured metallizing of the surface of substrates

摘要

Structured metallisation of a substrate, esp. circuit board (1), is carried out by (a) applying an electrically non-conductive primer layer (2) over the entire substrate surface; (b) applying an electrically non-conductive cover layer (4) over the entire surface of the primer layer (2) to a thickness equal to that of the metal layer (3) to be applied; (c) selectively removing cover layer portions by means of UV electromagnetic radiation (pref. laser radiation) to form structures with sharp and steep flanks and to expose the primer layer; and (d) applying a metal layer (3) in the structures from a reductive plating bath to form circuit lines.