| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability by reducing the number of bonding interfaces between a semiconductor chip and a lead frame. SOLUTION: First, a read frame 120 having a plurality of internal leads 122 and a plurality of external leads 124 is provided. Next, liquid adhesive having a predetermined viscosity is applied to lower surfaces of the inner leads 122. Then, an active surface 112 of a semiconductor chip 110, where a plurality of electrode pads 114 are formed, is provided under the adhesive-applied lead frame 120, and the semiconductor chip 110 and the lead frame 120 are positioned with each other, such that each electrode pad 114 is exposed in space between adjacent inner leads 122. Next, the active surface 112 of the semiconductor chip 110 are bonded to the inner leads 122 of the lead frame 120 with the adhesive. |
