| 摘要 |
PROBLEM TO BE SOLVED: To provide a uniform surface throughout the whole face of a substrate, by comprising a flat upper face including at least two areas of the different pad materials, and extending these areas with a non-radiating pattern in a direction crossing a pad. SOLUTION: A pad 20 comprises the alternate concentric rings of hard non- compressive pads H and soft/sponge-like pads S. The hard area and the soft area are extended with a non-radiating pattern in the direction crossing the pad 20. By using the hard pad H, the uniformity of the wafer surface is totally and partially improved, and the soft/sponge-like pad S captures the slurry, and sends the same to a lower side of the wafer. As mentioned above, by alternately giving the compressibility, the pads are alternately entered between the polishing surface and the slurry. Further when the pad is rotated to polish the wafer, the sudden transition over the parts of the pad can be prevented. |
