Apparatus for correcting and holding front surface of sheet

摘要

An apparatus for correcting an orientation and a geometry of a front surface of a semiconductor wafer and holding the wafer in a state in which the adjusted surface state is kept. The apparatus has a chuck for holding a wafer; a surface measuring means for measuring a state of a front surface of the wafer; a surface adjusting means including a plurality of surface correcting portions vertically movable for partially deforming the holding portion, whereby the surface of the holding portion is deformed by independent actions of the surface correcting portions; and a tilting portion as an orientation adjusting means for adjusting a tilting angle of the front surface of the wafer with respect to the center axis thereof and an orientation of the tilting. The tilting angle of the front surface of the wafer with respect to the center axis thereof and the orientation of the tilting, and further the geometry of the front surface of the wafer are corrected by a manner of measuring them by the surface measuring means, and controlling them on the basis of the measured results by both the orientation adjusting means and the surface adjusting means.