| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which has excellent moldability, can give a cured product being excellent in soldering-heat resistance, affected little by the absorbed moisture and scarcely causing electrode corrosion resulting in disconnection and leak current generation due to moisture by using a biphenyl-type epoxy resin, a phenolic resin, a titanate coupling agent and a fused silica powder having a specified particle diameter and a cure accelerator as the essential components. SOLUTION: This composition consists essentially of a biphenyl-type epoxy resin represented by formula I, a phenolic resin, a titanate coupling agent represented by formula II (R<1> and R<2> are each an alkyl), 25-90wt.%, based on the composition, fused silica having a maximum particle diameter of 100μm or below and a cure accelerator. The cure accelerator which can be used is a phosphorus cure accelerator, an imidazole cure accelerator or a DBU cure accelerator and is used in an amount of desirably 0.01-5wt.% based on the composition.
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