| 摘要 |
In a chemical mechanical polishing (CMP) device, a semiconductor wafer is held by a carrier with its surface to be polished facing upward. A polishing belt is fed from one reel and taken up by the other reel by way of pulleys, running in contact with the surface of the wafer to be polished. A conditioning pad conditions the front or polishing surface of the belt facing the wafer. A nozzle feeds polishing slurry to the rear of the belt not facing the wafer. A plurality of press rollers cause the slurry to exude from the front of the belt while pressing the slurry and belt against the surface of the wafer. The belt filters out impurities introduced into the slurry.
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