发明名称 Molding apparatus
摘要 A molding apparatus includes a molding box structure with an adjustable internal spacing, a metal mold accommodated in the molding box structure, a thermally expanding, member accommodated in the molding box structure to be arranged in pressure transmitting, relation with the mold member, and a temperature adjuster for adjusting a temperature of the thermally expanding member so that the material thermally expands and contracts. The molding box structure includes a pair of support elements fixed by threaded struts and nuts so that the support plates are spaced from each other. The apparatus further includes an auxiliary pressurizing mechanism including two wedge-shaped plates having respective tapered face, and spaced from each other so that the tapered faces are opposed to each other and so that an overlap between them is adjustable, and an actuator for driving the wedge-shaped plates. The molding box structure has a slide shelf formed on its one side so that the mold is slid onto it as it is moved out of the molding box structure. The temperature adjuster is disposed around and through the thermally expanding material and includes a cooling oil circulated through the thermally expanding member for cooling it and a carbon heater for heating the thermally expanding member.
申请公布号 US5811135(A) 申请公布日期 1998.09.22
申请号 US19970784317 申请日期 1997.01.16
申请人 YUGENKAISHA AIKO 发明人 KIMURA, SEIICHI
分类号 B22D17/22;B22D17/26;B29C33/02;B29C33/20;B29C33/22;B29C33/24;B29C45/64;(IPC1-7):B29C33/20 主分类号 B22D17/22
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