| 摘要 |
<p>PROBLEM TO BE SOLVED: To apply processing such as etching, cleaning, drying and the like to both the surfaces of a disc while the disc is being rotated. SOLUTION: Paired fixing pins 4a and 4B on which a wafer 21 is rested, are provided for each tip end of three supporting arms 2a through 2b whose base ends are mounted to a rotating shaft 3. An auxiliary supporting pins 8 are also provided for the aforesaid paired pins in such a way that the rotated wafer 21 can be supported horizontally regardless of the position of the orientation flat 22 of the wafer 22. Furthermore, paired movable pins 9a and 9b are provided for each tip end of the respective supporting arms 2a through 2b while each space between the paired movable pins is kept wider as specified than a chord L between the orientation flats 22, and the rocking in the radial direction of the wafer 21 of the aforesaid paired movable pins thereby allows the wafer 21 to be held at its outer circumferential part. Thus as mentioned above, processing is applied thereto while the water 21 is being rotated.</p> |
