EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR,申请号JP19970055699-传众专利搜索

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发明名称	EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
摘要
申请公布号	JPH10251520(A)	申请公布日期	1998.09.22
申请号	JP19970055699	申请日期	1997.03.11
申请人	SUMITOMO BAKELITE CO LTD	发明人	OTA MASARU
分类号	C08L61/06;C08L63/00;C08L83/12;H01L23/29;H01L23/31;(IPC1-7):C08L83/12	主分类号	C08L61/06
代理机构		代理人
主权项
地址

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