发明名称 METAL PLATE FOR ELECTRONIC EQUIPMENT AND ELECTRONIC EQUIPMENT COMPONENT OR ELECTRONIC EQUIPMENT APPARATUS USING THE METAL PLATE
摘要 PROBLEM TO BE SOLVED: To prevent generation of obstruction of a function of a component or apparatus due to gas generated during use, with excellent moldability. SOLUTION: An organic resin film having a frictional coefficient of 0.3 or less and surface roughness Ra of 1.0 to 30μm is formed in a thickness of 6μm or more on one surface of a metal material piece having a tensile strength of 75MPa or more, a strength of 25MPa or more and an elongation of 10% or more. Since the piece having excellent mechanical properties is used and the film is formed in the thickness of 6μm or more on its one surface with the predetermined coefficient and roughness, its moldability is excellent. With the component molded with the film forming surface at its output, the component is not contaminated with gas dissipating from the film, and the component or apparatus functions satisfactory for a long term.
申请公布号 JPH10249994(A) 申请公布日期 1998.09.22
申请号 JP19970193926 申请日期 1997.07.18
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 SATO TAKAHIRO;JIDO BUNJI
分类号 B21D22/20;B32B15/08;C22C21/00;G11B33/02;(IPC1-7):B32B15/08 主分类号 B21D22/20
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