Semiconductor chip package device having a rounded or chamfered metal layer guard ring

摘要

A semiconductor chip packaging device includes a lead frame electrically connected to the chip and mechanically supporting the chip; a metal layer guard ring formed along at least one peripheral edge of an active surface of the chip; at least one slit formed at corner parts of the chip; a passivation layer covering the metal layer guard ring, the chip and the lead frame; and a package body made of a molding resin encapsulating the passivation layer, the lead frame, the metal layer and the chip; the metal layer guard ring being chamfered or rounded at corner parts of the chip to reduce shear stresses at the corner parts of the chip.