| 摘要 |
PROBLEM TO BE SOLVED: To provide a uniform surface throughout the whole face of a substrate, by comprising a geometric center part, having plural projections expanding in an almost peripheral direction, and eccentrically mounting the geometric center part to the center part of an abrasive pad. SOLUTION: A pad 20 comprises a geometric center part A, and the concentric circles in a peripheral direction, that is, an eccentric center part B. A passage having a groove, is formed on the flat inside of the pad 20. A passage area with groove 10, prevents the impression to be generated inside of a wafer face at the polishing, by using only the completely concentric circles. In the polishing of the wafer, the slurry is kept at a lower part of the wafer face, when the wafer is pressed inside of the pad 20 face. The groove acts as the slurry reservoir for reserving the slurry. Accordingly the slurry always exists when the wafer is brought into contact with the slurry. The whole face of the wafer can be uniformly flattened, and the residual film on the wafer face can be uniformly flattened, even when a hard pad is singly used, or when the accumulated pads having the eccentric groove, is used. |
