MEMORY CARD AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To largely improve impact resistance reliability by mounting electronic components in a high density. SOLUTION: This memory card 1 comprises chip components such as TCP memory 4, SOP memory 5, reset IC 7, resistors and capacitors mounted in two-stage on a surface of a printed circuit board 2 fixed by connecting a connector provided at one side to a memory case MK, and a microcomputer 10 and a gate array 11 COB outed on a rear surface. A package surface of the microcomputer 10 and the array 11 is adhered to an inner surface of the case MK opposed to its package surface via a double-sided tape 12, and the board 2 is effectively fixed.