发明名称 SHEET MACHINING DEVICE FOR WAFER
摘要 PROBLEM TO BE SOLVED: To eliminate the effect of slurry supply pressure, easily balance pressure on both sides of a work and apply uniform machining including lapping and polishing to both sides of the work. SOLUTION: A reference-side ring surface plate 13 and a moving-side ring surface plate 23 which are rotatably arranged in opposition on both side of a work W are supported by cylindrical rotation bearings 16, 26 with both open ends. Slurry supply pipes 18, 28 are inserted through the cylindrical rotation bearings 16, 26 to make end nozzles 19, 29 face to both sides of the work W. The work W is rotated by a driving roller contacting the surface. The ring surface plate 13, 23 are rotated, while abrasive grain suspended slurry A is supplied from the slurry supply pipes 18, 28 to both sides of the work W, to apply machining including lapping and polishing to both sides of the work W.
申请公布号 JPH10249723(A) 申请公布日期 1998.09.22
申请号 JP19970057937 申请日期 1997.03.12
申请人 SUPER SILICON KENKYUSHO:KK 发明人 MINAMI SHIYUUBIN
分类号 B24B37/04;B24B37/08;H01L21/304 主分类号 B24B37/04
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