| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor module formed so as to minimize the influence of an adhesive agent to fix optical fibers on an optical semiconductor element disposed in a package and ensure a high air tightness. SOLUTION: Hermetic seal with a low melting point glass 12 is used only between short optical fibers 9 and metal pipe 10 while hermetic seal between a package 4 and cap 8 uses a solder preform 7. The package 4 can be hermetically sealed with minimizing the influence of an adhesive agent to fix the fibers 9 on an optical semiconductor element 1 disposed in the package 4. The hermetic seal adopts a technique suited to highly air tight sealing methods, the low melting point glass and solder sealings, thereby raising the air tightness reliability. |
