| 摘要 |
Without using a photolithography technique, a semiconductor mounting substrate having micronized wirings can be obtained by simple manufacturing steps in a short time. Flaws 2 are formed in a substrate 1, and metalized layers 3 by en electroless plating are formed thereon, whereby micronized wirings are formed. Moreover, the flaws 2 are formed also by laser or a diamond indentation tool to which ultrasonic wave is applied. <IMAGE> |
