METAL FOIL WITH RESIN FOR MANUFACTURING MULTILAYER WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a metal foil with resin for manufacturing multilayer wiring board having high interlayer connecting reliability. SOLUTION: The metal foil is formed by coating a surface of the foil 1 with insulating resin 2 and used to manufacture the multilayer wiring board by laminating it on a circuit board 4 on which a wiring pattern has been already formed. Such metal foil is mixed with particles having thermal expansion coefficient of 10ppm/ deg.C or less in the resin 2. The coefficient of the resin 2 can be reduced by the particles having the coefficient of 10ppm/ deg.C or less.