发明名称 THERMOPLASTIC RESIN COMPOSITION FOR INJECTION MOLDING
摘要 PROBLEM TO BE SOLVED: To obtain a thermoplastic engineering resin capable of giving a molded product of good appearance with no flow mark and/or burr through injection molding. SOLUTION: This resin composition comprises (A) 99-70wt.% of a thermoplastic engineering resin and (B) 1-30wt.% of an acrylic copolymer formed by copolymerization between 50-95wt.% of methyl methacrylate, 5-50wt.% of an a 1-10C alkyl acrylate and 0-45wt.% of another vinyl monomer copolymerizable therewith, having a reduced viscosity of 1-15 (determined in the form of a solution prepared by dissolving 0.1g of the copolymer B in 100cc of chloroform at 25 deg.C).
申请公布号 JPH10251524(A) 申请公布日期 1998.09.22
申请号 JP19970053001 申请日期 1997.03.07
申请人 MITSUBISHI RAYON CO LTD 发明人 UEDA KAZUO;IWASAKI TADASHI;KAWASUJI HIROSHI
分类号 B29C45/00;C08L101/00;(IPC1-7):C08L101/00 主分类号 B29C45/00
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