发明名称 |
THERMOPLASTIC RESIN COMPOSITION FOR INJECTION MOLDING |
摘要 |
PROBLEM TO BE SOLVED: To obtain a thermoplastic engineering resin capable of giving a molded product of good appearance with no flow mark and/or burr through injection molding. SOLUTION: This resin composition comprises (A) 99-70wt.% of a thermoplastic engineering resin and (B) 1-30wt.% of an acrylic copolymer formed by copolymerization between 50-95wt.% of methyl methacrylate, 5-50wt.% of an a 1-10C alkyl acrylate and 0-45wt.% of another vinyl monomer copolymerizable therewith, having a reduced viscosity of 1-15 (determined in the form of a solution prepared by dissolving 0.1g of the copolymer B in 100cc of chloroform at 25 deg.C). |
申请公布号 |
JPH10251524(A) |
申请公布日期 |
1998.09.22 |
申请号 |
JP19970053001 |
申请日期 |
1997.03.07 |
申请人 |
MITSUBISHI RAYON CO LTD |
发明人 |
UEDA KAZUO;IWASAKI TADASHI;KAWASUJI HIROSHI |
分类号 |
B29C45/00;C08L101/00;(IPC1-7):C08L101/00 |
主分类号 |
B29C45/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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