发明名称 Direct deposition of palladium
摘要 The present invention is directed to a process for forming a layer of palladium on a substrate, comprising: preparing a solution of a palladium precursor, wherein the palladium precursor consists ofPd(OOCR1)m(OOCR2)nwherein R1 is hydrogen, alkyl, alkenyl, alkynyl, -R3COOH, alkyl from 1 to 5 carbons substituted with one or two hydroxyl groups, R2 is hydrogen, alkyl, alkenyl, alkynyl, -R3COOH, alkyl from 1 to 5 carbon atoms substituted with one or two hydroxyl groups, -CHO, R3 is alkyl, and alkyl groups from 1 to 5 carbon atoms substituted with one or two hydroxyl groups m and n are real numbers or fractions, and m+n=2; applying the palladium precursor to the surface of the substrate; decomposing the palladium precursor by subjecting the precursor to heat.
申请公布号 AU6184698(A) 申请公布日期 1998.09.18
申请号 AU19980061846 申请日期 1998.02.24
申请人 THE WHITAKER CORPORATION 发明人 SUNITY K. SHARMA;KULDIP K. BHASIN;SUBHASH C. NARANG;ASUTOSH NIGAM
分类号 C23C18/08;H05K3/10 主分类号 C23C18/08
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