| 摘要 |
The invention concerns a device for placing a secondary element affixed on a silicon substrate under a main element, itself affixed on a silicon substrate, characterised in that it comprises: a silicon substrate (2a) initially bearing main elements (1a); means for locating (9) the position of the main elements (1a); a bevelled blade (7a) for detaching the elements (1a); a silicon substrate (2b) initially bearing secondary elements (1b); a bevelled blade (7b) for detaching the secondary elements (1b), and located at a point where the two silicon supports (2a) and (2b) are close; adjusting means co-operating with locating means, such that the elements detached by the bevelled blade are positioned on the silicon substrate (2a) in the exact place initially taken up the substrate of the elements (1a); the silicon substrate (2a) returning to level of the bevelled blade (7a) and receiving the elements (1a), which are urged to be positioned in the exact place initially taken up by the elements (1a).
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