发明名称 |
DISPOSITIF A SEMICONDUCTEURS COMPORTANT UN BOITIER ET UNE EMBASE ISOLANTE, ET PROCEDE DE FABRICATION DE CE DISPOSITIF |
摘要 |
<p>It is an object of the present invention to obtain a power semiconductor device with small size and high reliability in power semiconductor devices having integral structure of case and external connection terminals. A dummy pad (42) having no electric connection with other parts is provided and a terminal end of a connecting wire (46) connecting by sequentially bonding an exposed surface of a connection electrode (43) and a bonding pad (41) of a semiconductor element (40) is bonded thereto. The semiconductor device can be miniaturized without deteriorating electric characteristics and reliability of the semiconductor elements.</p> |
申请公布号 |
FR2726940(B1) |
申请公布日期 |
1998.09.18 |
申请号 |
FR19950006472 |
申请日期 |
1995.05.31 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
ARAI KIYOCHI;TAKAGI YOSHIO;IWASA TATSUYA |
分类号 |
H01L25/07;H01L25/18 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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