| 摘要 |
<p>The apparatus and method for assembly of hybrid modules (50) including semiconductor chips (14) and conventional surface mount technology (SMT) components (16) are disclosed. The disclosed method uses the vacuum oven (86) for creating the permanent electrical connection between each semiconductor chip (14) and the hybrid module (50) and the soldering reflow process to attach each SMT component (16) to the hybrid module (50). The processes of assembling the SMT components and the semiconductor chips are integrated. The integrated automated assembling process provides excellent thermal properties for the hybrid module.</p> |
