PRINTED CIRCUIT BOARD FOR ELECTRICAL DEVICES HAVING RF COMPONENTS, PARTICULARLY FOR MOBILE RADIO TELECOMMUNICATION DEVICES

摘要

The invention aims to raise the packing density of electronic circuits and printed conductor structures on circuit boards intended for electrical apparatus having HF components, notably mobile radiocommunications equipment. To this end, a "micro via" layer (M2) is first applied to one or both sides of a circuit board substrate (LPT4). Thereafter, especially HF circuits and HF printed conductor structures (LBS3HF) are placed onto at least part of the "micro via" layer (M2). The HF circuits and HF printed conductor structures (LBS3HF) are protected in relation to an HF mass layer of the circuit board substrate by blocking zones arranged in a substrate layer (LPL2) of the circuit board layer situated directly below the "micro via" layer (M2) against interfering influences which affect the HF parameters to be adjusted of the HF circuits or HF printed conductor structures LBS3HF).