<p>A socket for a ball grid array integrated circuit package (BGA) with an array of electrical contacts (12) that extend through holes in a slidable plate. The arrangement of spacing holes (14) and the electrical contacts therein provide entry openings that allow the ball contacts (16) of a BGA package to enter the openings. The contacts are cupped or angled to mate with the side and top of the ball contacts of the ball grid array package. The plate (3) is spring loaded driving the plate parallel to the plane of the ball contacts in a manner that reduces the entry hole opening. The angled or cupped ends (24) of the socket contacts mate with the ball contacts above the equator of the ball.</p>
