UMSCHMELZPROZESS FÜR LEITERPLATTEN

摘要

The reflow process for the tin/lead layers is carried out at elevated ambient gas pressure in a pressurised container. The amount of heat needed for the reflow can be supplied by the known methods (infrared radiation, oil etc.) or, alternatively, by heating the pressurised gas itself. The pressurised gas can, if necessary, also be designed to act as a protective gas.