发明名称 |
Electric field test of integrated circuit component |
摘要 |
The manufacture of an integrated circuit chip includes testing the integrated circuit while an external electric field is applied to the integrated circuit to facilitate detection of open circuit type defects. The electric field may be provided by applying a high potential to a plate parallel to a plane of the integrated circuit or by applying a high potential to a probe and moving the probe across the surface of the integrated circuit chip to obtain information regarding the location of the defect. Use of a probe type electric field generator allows the approximate position of the defect to be determined. The invention enhances current testing and diagnostics methods for wafers, chips, and integrated circuit packages by allowing detection of floating net defects during other conventional tests.
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申请公布号 |
US5807763(A) |
申请公布日期 |
1998.09.15 |
申请号 |
US19970851142 |
申请日期 |
1997.05.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MOTIKA, FRANCO;MOTIKA, PAUL;NIGH, PHIL |
分类号 |
G01R31/28;G01R31/312;(IPC1-7):H01L21/66 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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