| 摘要 |
A printed wiring board having a substrate, a plurality of load circuits formed on the substrate, a drive circuit formed on the substrate, for driving the load circuits, a first wiring pattern formed on the substrate and connected to the load circuits, and a second wiring pattern formed on the substrate, for connecting the drive circuit and the first wiring pattern. The width of the second wiring pattern is set larger than that of the first wiring pattern, so as to eliminate the mismatch between the characteristic impedance of the second wiring pattern and the characteristic impedance of the first wiring pattern.
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