发明名称 Printed circuit board to housing interconnect system
摘要 A printed circuit board to housing interconnect system capable of withstanding "hot" connects and disconnects of conductors carrying currents of up to 15 amperes or more while maintaining RF performance. The interconnect system may be used to couple power lines or RF signal lines from a printed circuit board to a high power system. The interconnect system allows a printed circuit board to be installed or removed from a system without having to power down the system in order to perform installation or removal.
申请公布号 US5807117(A) 申请公布日期 1998.09.15
申请号 US19960680483 申请日期 1996.07.15
申请人 AUGAT INC. 发明人 KEMPF, ANDREW J.;PERRY, JASON;LOCATI, RONALD P.
分类号 H01R13/18;H01R13/646;(IPC1-7):H01R9/09 主分类号 H01R13/18
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