发明名称 |
Applying adhesive to substrates |
摘要 |
Applying adhesive in a desired pattern on a substrate by determining one or more inspection sites for monitoring adhesive deposition, applying adhesive to a substrate with a stencil or screen printer, viewing the inspection sites with a camera that generates image signals, and processing the image signals to determine if adhesive has been properly applied at the inspection sites.
|
申请公布号 |
US5807606(A) |
申请公布日期 |
1998.09.15 |
申请号 |
US19970904007 |
申请日期 |
1997.07.31 |
申请人 |
MPM CORPORATION |
发明人 |
MOULD, DOUGLAS K.;RENDA, JR., JOSEPH;HALL, STEVEN W. |
分类号 |
B05C11/10;H05K1/02;H05K3/12;H05K3/30;(IPC1-7):B05D1/36 |
主分类号 |
B05C11/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|