发明名称 Applying adhesive to substrates
摘要 Applying adhesive in a desired pattern on a substrate by determining one or more inspection sites for monitoring adhesive deposition, applying adhesive to a substrate with a stencil or screen printer, viewing the inspection sites with a camera that generates image signals, and processing the image signals to determine if adhesive has been properly applied at the inspection sites.
申请公布号 US5807606(A) 申请公布日期 1998.09.15
申请号 US19970904007 申请日期 1997.07.31
申请人 MPM CORPORATION 发明人 MOULD, DOUGLAS K.;RENDA, JR., JOSEPH;HALL, STEVEN W.
分类号 B05C11/10;H05K1/02;H05K3/12;H05K3/30;(IPC1-7):B05D1/36 主分类号 B05C11/10
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